Technologies
Technologies
The modular AXI system concept provides the unique capability to use several inspection technologies in one system. Depending on the specific application request the optimum inspection technique can be selected and/or combined.
- High-speed inspection technique with up-to 5-6 images/sec. and with best high-resolution capability (II,FPD)
- Transmission is two-dimensional image capturing with a fixed detector position
- Movable sample tray and movable X-ray tube (z axis) for different magnifications
- Matrix patented inspection technique to separate Top and Bottom side for double-sided PCB-assembly applications
- High-speed technique using first side image to filter out from double-side image
- AXI on programmable angle-shots up to 50 (60) dgr (used for high performance BGA and PTH inspection)
- 3D-Tomsynthesis to generate multiple horizontal slices used for high-dense double-sided and multi-chip-modules (MCM,LGA,…)
- Fastest inspection technique using continuous scan via Line-Scan Detector to generate a large area X-ray image
- Computer Tomography
- Using up to 360 dgr angle-shot projections for full volume reconstruction
- Advanced Referential Analyzing
- Difference image technique using reference image to be processed with live image to separate defects and or extra objects
