X3 S

The MatriX X3-S is an automatic X-ray inspection system featuring combined Transmission and 3D-Technology for sophisticated high-speed inspection in electronic production. The system is based on the MatriX X2.5 AXI system platform but is equipped with an additional detector axis used to generate the angle-shot images for the 3D reconstruction. This newly developed 3D reconstruction software generates high resolution slice images for 3D analysis of solder joints. Main applications are double-sided boards with critical overlapping areas.

• High Speed Inline AXI system
• Maintenance free sealed X-ray tube and digital detector technology
• 5 axes programmable motion
• Component in-tray handling setup (with automatic top clamp for parts)
• Inline pass-trough or dual lane in/out setup
• Automatic grey-level and geometrical calibration
• Full product traceability via customized MES-Interface
• Mixed inspection mode (transmission and dynamic 3D sart)

Transmission (2D)
Off-axis (2.5D)
3D SART

4-5 images/sec
3-4 images/sec
1 s /FOV (dynamic 3D mode)

standard:
130kV/40W

optional:
120kV/40W

standard:
CMOS Flatpanel Detector
(14 bit, 1k x 1k, 75 µm)

optional:
CMOS Flatpanel Detector
(14 bit, 1,5k x 1,5k, 75 µm)
CMOS Flatpanel Detector
(14 bit, 2,3k x 2,3k, 50 µm)